Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum. Heatsink Exteral Size: 0.79" x 0.79" x 0.43" / 20mm x 20mm x 11mm. Widely used for Electronic, CHIP, Raspberry pi, 3D printer, MOS, IC computer 's component, etc. Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation. Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating. Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.
What is this?
- Copper heatsink is a popular thermal management option among electronic devices because of its capacity to absorb heat relatively quickly.
- The Skived Copper Heatsink can reduce the overheating of electronic components. For example, gaming generates a lot of heat in your computer, If you game, then it is important to reduce heat in the place you need.
- The Copper Heat Radiator Widely used for Electronics, CHIP, Raspberry pi, 3D printer, MOS, IC, Computer 's component, etc.
Is there any advantages of the product?
- The 20x20mm heat sink is made of a solid piece of pure copper, the thermal conductivity up to 401W/(mK.), thus can absorb heat relatively quickly and help improve thermal efficiency.
- The Copper Skived Heatsink offers excellent thermal properties compared with other manufacturing methods as it offers a thin finned heatsink, with a dense population of uniformly shaped and distributed fins, thus greatly improve heat dissipation efficiency and extend the service life of heating components.
- The Copper Skived Fin Heatsink can be used for heat transfer of machines with large power.
Specification:
- Material: Pure Copper
- Processing method: Skiving fin
- Finishing: Antioxidant treatment
- Exteral Size: 0.79" x 0.79" x 0.43" / 20mm x 20mm x 11mm
- Bottom Thickness: 0.12"/ 3mm
- Copper Fin Thickness: 0.02"/ 0.4mm
Package Included: