Includes 4pcs 40mm copper pad shim, low profile High performance copper thermal pad shim with thermal conductivity of 400 W/m-k Dimension: 40mm x 40mm x 0.5mm / 1.57″ x 1.57″ x 0.02″ Unit weight: 7 gram / 0.25 oz. Can be applied for gap filler in cooling of IC Chips, Development Boards Laptop GPU CPU Tec1-12706 etc. Thermal conductive heatsink copper pad shims

This heat sink kit includes: 4pcs low profile 40mm x 40mm x 0.5mm / 1.57″ x 1.57″ x 0.02″ copper pad shim.

[Main Body Material: Copper]. Thermal conductivity: 401W/mK

Can be applied as a gap filler, thermal conductance in cooling of the Sony Playstation 3 PS3, Thermoelectric Peltier Module TEC1-12706, 3D printer, Development Boards Laptop GPU IC Chips, etc.