ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 15W / mK, the GP-ULTIMATE offers first-class performance. SIMPLE APPLICATION: The GP-ULTIMATE is easy to use thanks to its thermal dimensions of 120x120mm. NON-ELECTRICAL CONDUCTIVITY: The GP-ULTIMATE is non-electrically conductive, non-corrosive, non-hardening and non-toxic. PERFECT SIZES: The GP-ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components. AVAILABILITY OF THE THIN: The GP-ULTIMATE is available in different thicknesses of 0.5, 1.0, 1.5, 2.0 and 3.0mm. The GP-Ultimate 120×120 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition, and the ultimate 15W/mK thermal conductivity, the GP-Ultimate 120×120 offers the best performance in class. The GP-Ultimate 120×120 is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60°C to 220°C. It features seamless application and has the thermal pad dimensions of 120x120mm to best fit enlarged surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.