𝐀𝐔𝐓𝐎𝐌𝐀𝐓𝐈𝐂 𝐖𝐄𝐋𝐃𝐈𝐍𝐆:The SMD SMT reflow oven is automatically controlled by a microcomputer, completing the entire welding process from preheating, soaking, reflow welding to cooling. This reflow soldering furnace can solder various packaging forms of single-layer and double-layer PCB boards. Desktop reflow oven soldering station was applicable to Φ 110mm exhaust pipe 𝐖𝐈𝐃𝐄 𝐖𝐄𝐋𝐃𝐈𝐍𝐆 𝐀𝐑𝐄𝐀: Welding furnace, T-962 automatic infrared hot air reflow oven welding area: (180 * 235mm), greatly increasing the range of use of this machine and saving investment. Rated power of welding oven: 800 watts. Reflow oven provide eight temperature parameter waveforms for memory reflow welding machine selection, and can set forced heating and cooling functions; The entire welding process is completed automatically and the operation is simple 𝐔𝐍𝐈𝐐𝐔𝐄 𝐓𝐄𝐌𝐏𝐄𝐑𝐀𝐓𝐔𝐑𝐄 𝐑𝐈𝐒𝐄 𝐀𝐍𝐃 𝐔𝐍𝐈𝐅𝐎𝐑𝐌 𝐓𝐄𝐌𝐏𝐄𝐑𝐀𝐓𝐔𝐑𝐄 𝐃𝐄𝐒𝐈𝐆𝐍: PCB reflow oven T962 with a fast infrared heating and uniform temperature fan with an output power of 800W, the temperature is more accurate and uniform. Reflow soldering oven can automatically and accurately complete the entire production process according to your preset temperature curve without the need for manual operation. Infrared reflow oven’s temperature range: 0 ℃ -280 ℃; Cycle time: 1-8 minutes 𝐇𝐔𝐌𝐀𝐍𝐈𝐙𝐄𝐃 𝐓𝐄𝐂𝐇𝐍𝐎𝐋𝐎𝐆𝐈𝐂𝐀𝐋 𝐌𝐀𝐒𝐓𝐄𝐑𝐏𝐈𝐄𝐂𝐄𝐒: Automatic reflow soldering station with rugged appearance, visible operation, user-friendly human-machine interface, perfect temperature curve scheme, reflecting technology as the foundation from beginning to end; Reflow soldering machine's lightweight volume and weight allow you to save a lot of money, and the tabletop placement mode allows you to have more space; A simple operation manual that you can read at a glance 𝐂𝐎𝐌𝐏𝐋𝐄𝐓𝐄 𝐅𝐔𝐍𝐂𝐓𝐈𝐎𝐍 𝐒𝐄𝐋𝐄𝐂𝐓𝐈𝐎𝐍:Functions such as reflow soldering, drying, insulation, shaping, and rapid cooling are integrated into one; T962 infrared reflow oven can complete single and double-sided PCB board soldering for all packaging forms such as CHIP, SOP, PLCC, QFP, BGA, etc; Automatic reflow oven can be used for various tasks such as product adhesive curing, circuit board thermal aging, PCB board maintenance, etc. Reflow soldering oven was widely applicable to various enterprises, company Product Description
Overview:
The product is controlled by a microcomputer and pre stores eight types of reflow temperature control curves for users to choose from. It can meet the requirements of SMD and BGA soldering with lead and lead-free according to national and American standards, with simple operation and automatic completion of the entire soldering process;
Fast infrared radiation and circulating wind heating make the temperature more accurate and uniform; Fuzzy temperature control technology and visual drawer style workbench enable the entire welding process to be automatically completed under your supervision; Can complete the welding of single and double-sided boards, and can weld the most precise surface mount components.
Adopting a maintenance free and highly reliable design, you can use it with satisfaction and peace of mind.

Technical parameters:
Effective welding area: 18 x 23.5 cmProduct dimensions: 31 x 29 x17 cm
Product packaging size: 36 x 23 x 36 cm
Rated power: 800W
Process cycle: 1-8 minutes
Power supply voltage: AC 110V (220V optional)/50-60Hz